Presentation in Conferences

2025

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  • IEEE ICEIC 2025, Osaka, Japan (Sanghun Lee)

  • IEEE ASP-DAC 2025, Tokyo, Japan (Hoseong Kim)

  • Automotive World Japan 2025 (Junyoung Lee, Gihyun Jeon, Hyungjung Lee)

  • IEEE ICAIIC 2025, Fukuoka, Japan (Hoseong Kim, Gihyun Jeon)

  • IEEE COOLChips 2025, Tokyo, Japan (Minjung Kim, Gihyun Jeon)

  • IEEE VLSI-DAT 2025, Hishichu, Japan (Jisu Kwon)

  • IEEE DAC 2025, San Francisco, USA (Heejee Yun)

2024

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  • IEEE ICEIC 2024, Taipei, Taiwan (Heejee Yun, Gihyeon Jeon)

  • Automotive World Japan 2024 (Daejin Park)

  • IEEE ICAIIC 2024, Osaka, Japan (Daejin Park)

  • IEEE Percom 2024, France (Heejee Yun)

  • IEEE COOLChips 2024, Tokyo, Japan (Seunghyun Park, Gihyun Jeon)

  • IEEE VNC 2024, Kobe, Japan (Hyunjung Lee, Youngwon Jeon)

  • IEEE COMPSAC 2024, Osaka, Japan (Myeongjin Kang, Minjung Kim)

  • IEEE ISLPED 2024, California, USA (Heuijee Yun)

  • IEEE ISOCC 2024, Sapporo, Japan (Jaehun Kim)

  • IEEE EMSOFT 2024, Raleigh, NC, USA (Sunghoon Hong, Minjun Kim, Seunghyun Park)

  • IEEE GCCE 2024, Fukuoka, Japan (Jaehun Kim)

  • IEEE ICTC 2024, Jeju, Korea (Byungin Jung, Jongyun Byeon)

  • IEEE DSC 2024, Tokyo, Japan (Minjung Kim)

  • IEEE TENCON 2024, Singapore (Gihyun Jeon)

  • IEEE ISPACS 2024, Taichung, Taiwan (Seungmin Lee, Hyunjung Lee, Youngwon Jeon)

  • IEEE IRC 2024, Tokyo, Japan (Janghun Lee)

2023

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  • IEEE ICCE 2023, Las Vegas, USA (Heejee Yun)

  • IEEE ASP-DAC 2023, Tokyo, Japan (Jisu Kwon, Seunghyun Park, Junghyun An)

  • IEEE ICEIC 2023, Singapore, Singapore (Jaeyong Jung, Seunghyun Park)

  • IEEE ICAIIC 2023, Bali, Indonesia (Yonghun Lee, Sunghoon Hong)

  • IEEE COOLChips 2023, Tokyo, Japan (Heuijee Yun, Seunghun Park)

  • IEEE MWSCAS 2023, Phoenix, USA (Heejee Yun)

  • IEEE/ACM EMSOFT 2023, Hamburg, Germany (Jisu Kwon, Juneseo Chang)

  • IEEE ICTC 2023, Jeju, Korea (Myeongjin Kang)

  • IEEE ISOCC 2023, Jeju, Korea (Seunghyun Park)

  • IEEE IECON 2023, Singapore, Singapore (Dongkyu Jung)

  • IEEE ICMU 2023, Kyoto, Japan (Seungmin Lee, Minjung Kim)

  • IEEE MCSoC 2023, Singapore, Singapore (Seunghyun Park)

2022

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  • IEEE ICCE 2022, Las Vegas, USA (Juneseo Chabng)

  • IEEE ICEIC 2022, Jeju, Korea

  • IEEE ICAIIC 2022, Jeju, Korea (Heuijee Yun)

  • IEEE LifeTech 2022, Osaka, Japan (Soeun Park)

  • IEEE IST 2022, Virtual (Sunghoon Hong)

  • IEEE ICCE-TW 2022, Taipei, Taiwan (Seunghyun Park)

  • IEEE/ACM EMSOFT 2022, Shanghai, China (Juneseo Chang)

  • ACM Micro 2022, Chicago, USA (Heuijee Yun)

  • IEEE ISOCC 2022, Gangreung, Korea (Jisu Kwon)

  • IEEE ICTC 2022, Jeju, Korea (Sunghoon Hong)

  • IEEE A-SSCC 2022, Taipei, Taiwan (Seunghyun Park)

  • IEEE ISPACS 2022, Malaysia (Jisu Kwon)

  • IEEE ICCE-Asia 2022, Yeosu, Korea (Daegu High School Students)

  • ACM Multimedia ASIA 2022, Tokyo, Japan (Myeungjin Kang, Heuijee Yun)

2021

main 
  • IEEE ICEIC 2021, Jeju, Korea (Myeongjin Kang, Heejee Youn, Daeun Huo)

  • ACM HPC-Asia 2021, Jeju, Korea (Jisu Kwon)

  • IEEE ISCAS 2021, Daegu, Korea (Jisu Kwon)

  • IEEE LifeTech 2021, Kyoto, Japan (Dongkyu Jeong)

  • IEEE SmartIoT 2021, Jeju, Korea (Bohyun Seok)

  • IEEE ICUFN 2021, Jeju, Korea (Seungmin Lee, Dongkyu Lee, Seonghun Hong)

  • IEEE TENSYMP 2021, Jeju, Korea (Taewon Chong)

  • IEEE ISOCC 2021, Jeju, Korea (Dongkyu Lee, Sanghoon Lee)

  • IEEE ICCE-Asia, Korea (Joonghyun An, Myeungjin Kang, Bohyun Seok, Jinkyung Bae)

  • IEEE ISPACS 2021, Taiwan (Heuijee Yun)

  • IEEE MCSoC 2021, Singapore (Dongkyu Jung)

2020

main 
  • IEEE ICEIC 2020, Barcelona, Spain (Dongkyu Lee)

  • ACM HPC Asia 2020, Fukuoka, Japan (Daejin Park)

  • IEEE ICAIIC 2020, Fukuoka, Japan (Jisu Kwon)

  • World IT Congress 2020, Jeju, Korea (Dongkyu Lee, Jisu Kwon, Semyeung Oh)

  • IEEE LifeTech 2020, Osaka, Japan (Seungmin Lee)

  • IEEE COOLChips 2020, Tokyo, Japan (Jisu Kwon)

  • BIC 2020, Jeju, Korea (Seongho Cho, Seungmin Lee, Sanghoon Lee, Moon Gi Seok)

  • IEEE ICCE-TW 2020, Taipei, Taiwan (Myungjin Kang)

  • ACM SIGSIM PADS 2020, NY, USA (Moon Gi Seok)

  • IEEE GCCE 2020, Kobe, Japan (Seongho Cho)

  • IEEE ICCE-Asia 2020, Busan, Korea (Jisu Kwon)

  • CSA 2020, Jeju, Korea (Seungmin Lee, Dongkyu Lee)

2019

main 
  • IEEE ASP-DAC 2019, Tokyo, Japan (Moon Gi Seok)

  • IEEE ICAIIC 2019, Okinawa, Japan (Seungmin Lee)

  • IEEE BigComputing 2019, Kyoto, Japan (Dongkyu Lee)

  • IEEE COOLChips 2019, Yokohama, Japan (Jisu Kwon)

  • IEEE ICCE-TW 2019, Yilan, Taiwan (Hyeongrae Kim)

  • IEEE PICom 2019, Fukuoka, Japan (Hyungyun Moon)

  • IEEE GCCE 2019, Osaka, Japan (Dongkyu Lee)

  • IEEE ISPACS 2019, Taipei, Taiwan (Jisu Kwon)

  • ICNGC 2019, Chiang Mai, Thailand (Myeongjin Kang)

2018

main 
  • HiPEAC 2018, Manchester, United Kingdom

  • IEEE WF-IoT 2018, Singapore, Singapore (Hyeongrae Kim)

  • IEEE COOLChips 2018, Yokohama, Japan (Dongkyu Lee)

  • IEEE COMPSAC 2018, Tokyo, Japan

  • QCrypt 2018, Shanghai, China

  • IEEE MCSoC 2018, Hanoi, Vietnam (Hyungyun Moon)

  • IEEE GCCE 2018, Nara, Japan (Junho Kwak)

  • IEEE/ACM Micro 51, 2018 Fukuoka, Japan

  • IEEE DSC 2018, Kaohsiung, Taiwan (Jihun Kim)

  • ACM ICIT 2018, Hong Kong, China (Dongkyu Lee)

2017

main 
  • IEEE ASP-DAC 2017, Chiba, Japan

  • HiPEAC 2017, Stockholm, Sweden

  • ACM HPCA 2017, Texas Austin, U.S.

  • IEEE COOLChips 2017, Yokohama, Japan (Kiho Choi)

  • ICUFN 2017, Milan, Italy (Seongseop Kim)

  • IEEE DSC 2017, Taipei, Taiwan (Dongkyu Lee)

  • IEEE GCCE 2017, Nagoya, Japan (Hyungyun Moon)

  • Microsoft 2017, Seatle, USA

  • RISC-V Workshop 2017, Tokyo, Japan

2016

main 
  • ICCCE 2016, Singapore

  • ICAE 2016, Hongkong (Jiae Youn)

  • IEEE COOLChips 2016, Yokohama, Japan (Junghyun An)

  • ACM HPDC 2016, Kyoto, Japan (Moon Gi Seok)

  • ACM Cluster 2016, Taipei, Taiwan

  • IEEE GCCE 2016, Kyoto, Japan (Seongseop Kim)

2015

main 
  • IEEE/ACM ASP-DAC 2015, Chiba, Japan

  • IEEE COOLChips 2015, Yokohama, Japan (Sanghyun Lee)

  • IEEE ISLPED 2015, Roma, Italy

  • UWSS 2015, Beijing, China (Meng Di Yin)

  • FCST 2015, Dalian, China (Meng Di Yin)

  • IEEE GCCE 2015, Osaka, Japan (Jiae Youn)

2014

  • ITCS 2014, Taipei, Taiwan (Daejin Park)

2013

  • IEEE ICCE-Berlin 2013, Berlin, Deutschland (Daejin Park)

  • IEEE GCCE 2013, Yokyo, Japan (Daejin Park)

2012

  • ACM SpringSim 2012, Texas, USA (Daejin Park)

  • IEEE GCCE 2012, Tokyo, Japan (Daejin Park)

2011

  • IEEE COOLChips 2011, Yokohama, Japan (Daejin Park)

2010

  • IEEE ISOCC 2011, Seoul, South Korea (Daejin Park)