Support and Benefit for Members

Computing Environment

Private PC with tripple LCD monitors, high performance laptop (notebook) are given to all students. A partitioned space filled with the fresh air by standalone air-purifier is allocated for independent research. All equipments and materials including FPGA sytems for experiment are given with the unlimited cost.

Facilities

Our Lab posseses multi-processors Zeon-powered CAD workstation for SoC circuit design, DELL's 2 Zeon CPU-based high performance computing platform with 4 GPUs (NVidia 1080TI) for large-scaled simulation acceleration and the computing platform equipped with Alveo FPGA accelerator. Students can design their SoC using full licenses of Synopsys, Cadence, Mentor software. They can enjoy their rest using coffee machine, ice maker, and toaster.

International Conference Participation

Students with the accepted papers can get support for entire travel cost including boarding pass ticket, minimum twice per year.

Jiae Youn (2016 M.S.)

UWSS 2015, Beijing, China
IEEE GCCE 2015, Osaka, Japan
ICAE 2016, Hongkong

Meong Di Yin (2016 M.S.)

UWSS 2015, Beijing, China
FCST 2015, Dalian, China
IEEE GCCE 2015, Osaka, Japan

Jonnghyun An (2017 M.S.)

IEEE GCCE 2015, Osaka, Japan
ICCCE 2016, Singapore
IEEE COOLChips 2016, Yokohama, Japan

Seongseop Kim (2019 M.S.)

ACM HPDC 2016, Kyoto, Japan
ACM Cluster 2016, Taipei, Taiwan
IEEE GCCE 2016, Kyoto, Japan
ICUFN 2017, Milan, Italy
IEEE COMPSAC 2018, Toyko, Japan

Kiho Choi (2019 M.S.)

IEEE COOLChips 2017, Yokohama, Japan
IEEE DSC 2017, Taipei, Taiwan

Dongkyu Lee (Ph.D-Integrated Student)

IEEE DSC 2017, Taipei, Taiwan
HiPEAC 2018, Manchester, United Kingdom
IEEE COOLChips 2018, Yokohama, Japan
QCrypt 2018, Shanghai, China
Micro 51, 2018, Fukuoka, Japan
ICIT 2018, Hong Kong, China
IEEE BigComputing 2019, Kyoto, Japan
IEEE GCCE 2019, Osaka, Japan
ICEIC 2020, Barcelona, Spain

Hyeongyun Moon (M.S. Candidate)

IEEE GCCE 2017, Nagoya, Japan
IEEE COOLChips 2018, Yokohama, Japan
IEEE MCSoC 2018, Hanoi, Vietnam
IEEE PICom 2019, Fukuoka, Japan

Hyungrae Kim (Ph.D-Integrated Student)

IEEE DSC 2017, Taipei, Taiwan
IEEE WF-IoT 2018, Singapore, Singapore
Micro 51, 2018, Fukuoka, Japan
IEEE ICAIIC 2019, Okinawa, Japan
IEEE ICCE-TW 2019, Yilan, Taiwan

Junho Kwak (Ph.D-Integrated Student)

IEEE COMPSAC 2018, Toyko, Japan
IEEE MCSoC 2018, Hanoi, Vietnam
IEEE GCCE 2018, Nara, Japan
IEEE ICAIIC 2019, Okinawa, Japan
IEEE PICom 2019, Fukuoka, Japan

Jihun Kim (Ph.D-Integrated Student)

HiPEAC 2018, Manchester, United Kingdom
QCrypt 2018, Shanghai, China
IEEE DSC 2018, Kaohsiung, Taiwan

Jaeyong Jeong (M.S. Student)

IEEE DSC 2018, Kaohsiung, Taiwan
IEEE HISSD 2019, Fukuoka, Japan

Jisu Kwon (Ph.D-Integrated Student)

IEEE ASP-DAC 2019, Tyoko, Japan
IEEE COOLChips 2019, Yokohama, Japan
IEEE ISPACS 2019, Taipei, Taiwan
IEEE ICAIIC 2020, Fukuoka, Japan
IEEE COOLChips 2020, Tokyo, Japan

Myungjin Kang (Ph.D-Integrated Student)

IEEE COOLChips 2019, Yokohama, Japan
IEEE GCCE 2019, Osaka, Japan
ICNGC 2019, Chiang Mai, Thailand
ICEIC 2020, Barcelona, Spain